The molecular structure of Bisphenol A epoxy resin DY-128 contains aromatic rings and lateral hydroxyl groups, which are beneficial to improving adhesion; in addition, the aromatic ring structure also gives the resin high rigidity, tensile strength and thermal stability; overall, the main characteristics of bisphenol A epoxy resin include: the light curing reaction rate is very fast, the hardness and tensile strength after curing are large, the film gloss is high, and the chemical corrosion resistance is excellent.It can be widely used as a basic candidate resin for light-curing coatings, inks, and adhesives.
Bisphenol A epoxy resin DY-128 has good comprehensive mechanical properties, high-strength adhesion, small shrinkage, good thermal stability and excellent electrical insulation properties. It has been widely used in machinery, electronics, electrical appliances, aerospace and other fields as a resin matrix for coatings, adhesives, and composite materials.However, due to the high crosslinking density of the cured epoxy resin, the internal stress is large, and therefore there are shortcomings such as toughness, fatigue resistance, heat resistance, and poor impact resistance. It is difficult to meet the performance requirements of many actual engineering technologies, so that its application is subject to certain restrictions, especially restricting the epoxy resin can not be well used in structural materials and other types of composite materials.